金連接研發、生產、銷售應用于半導體芯片測試探針的鈀合金微細棒材、盤絲、管材等新型材料，產品質量達到行業先進水平，廣泛用于芯片探針、醫療、新能源及機電等領域。
GPAC110鈀銀銅合金棒材（芯片測試探針及電子觸頭用）
直棒：直徑從0.3mm-1.0mm,公差+0/0.005,長度≤1.3米
盤絲：直徑從0.1mm-1.0mm,公差+0/0.005,長度≤300米
材料成分：
|
Material |
GPAC110 |
|
|
Symbol of element |
Content of element |
CAS No. |
|
Silver Ag |
28.5 ± 1 |
7440-22-4 |
|
Palladium Pd |
40.0 ± 1 |
'7440-05-3 |
|
Copper Cu |
Balance |
7440-50-8 |
|
Product name |
Components |
Without Heat treatment |
Heat-treated material |
Melting point °C |
Young's module Gpa |
||
|
Hardness HV0.2 |
Volume resistivity μΩ·cm |
Hardness HV0.2 |
Volume resistivity μΩ·cm |
|
|||
|
GPAC110 |
Pd,Ag,Cu |
320+/-40 |
23 |
460-480 |
14 |
1050 |
110-120 |